Integrated Circuit Packaging Film
With outstanding dimensional stability, excellent high-temperature resistance, and precision barrier protection, it ensures the integrity and reliability of integrated circuits throughout production, transportation, and storage — giving you a competitive edge in the semiconductor supply chain.
Applications
Chip-on-film carrier tape packaging (COF / TAB)
SMD component tape-and-reel packaging
Features
- High Dimensional Stability
- Excellent High-Temperature Resistance
- Precision Barrier Protection
- Cleanroom-Grade Manufacturing
Benefits
- Chip-Level Precision Protection
- Automated Line Compatibility
- Lightweight Ultra-Thin Design
- Highly Customizable
Materials
- Standard and custom structures available
- Surface treatment options: Antistatic coating (ESD), release coating, or functional barrier coating
- Thickness specifications and surface performance parameters customizable upon request